Procedure for encapsulation of electronic devices

ABSTRACT

An encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed. The device is sealed hermetically against environmental and mechanical damage. The procedure includes the use of a thin cover lid holder and a substrate holder that are designed to handle thin substrates without damaging them. Thin substrates ensure sufficient mechanical flexibility for the OLED devices, and provides an overall thickness of less than 0.5 mm.

FIELD OF THE INVENTION

[0001] The present invention relates to organic light emitting diode (OLED) devices. More particularly, the invention relates to an encapsulation procedure for OLED devices.

BACKGROUND OF THE INVENTION

[0002]FIG. 1 shows a conventional OLED device 100. OLED devices can be used as displays in various consumer electronic products, including cellular smart phones, personal organizers, touch screen displays, multimedia equipment and virtual reality products. The basic advantages of OLED devices are low driving voltage, low power consumption, large viewing angle, high contrast, fast response, rugged design and the potential for low manufacturing costs.

[0003] The OLED device comprises a functional stack of one or more organic functional layers 110 between a transparent conductive layer 105 and a conductive layer 115. The functional stack is formed on a transparent substrate 101. The conductive layers can be patterned to form one or more cells or pixels on the substrate. In operation, charge carriers are injected through the cathodes and anodes for recombination in the functional layers. The recombination of the charge carriers causes the functional layer to emit visible radiation.

[0004] A cap 160, which forms a cavity 145 between it and the pixels, is mounted on the substrate. A sealant 187 is applied around the edges of the cap where it contacts the substrate. The cavity structure is necessary to protect the OLED layer from moisture, oxygen and other environmental influence, and to prevent mechanical interaction between the OLED layer stack and the packaging material, especially when mechanical pressure is applied from the outside.

[0005] The process of mounting the cap involves picking up the substrates, aligning the cap with the substrate, applying a sealant and pressing the substrate and cover cap together. The tools and procedures for encapsulation are designed for handling thick rigid glass (0.3-1.1 mm) or metal caps, and are not suitable for handling thin flexible substrate materials that break easily. The amount of mechanical flexibility achieved for the final product is negligible since metal caps and thick rigid glass sheets are used. These devices typically exhibit a thickness of more than 2 mm.

[0006] Thin substrate materials exhibit higher mechanical flexibility, and are suitable for small, light-weight and flexible applications. The tools and methods used for thick rigid substrates cannot be used for handling thin substrate materials without major adaptation.

[0007] As evidenced from the discussion above, it is desirable to provide an improved procedure designed for handling thin fragile substrates in the production of OLED devices.

SUMMARY OF THE INVENTION

[0008] The invention relates generally to OLED devices. In particular, the invention relates to the sealing procedure for device encapsulation, especially OLED devices on ultra thin flexible substrates.

[0009] In accordance with the invention, a substrate holder is provided to support the substrate containing the OLED active components. A cover lid is attached to a lid holder. In one embodiment of the invention, the cover lid is kept in place by adhesive tape that loses its adhesive property after a treatment process. In one embodiment, the treatment process comprises heat exposure. In another embodiment, UV radiation is used. Other types of treatment processes are also useful, depending on the adhesives used, e.g. usage of chemicals.

[0010] The lid holder is aligned with the substrate holder to place the lid on the substrate. With the use of the adhesive release tape, the fragile thin lid can be placed safely onto the substrate without breakage. In one embodiment of the invention, UV-curable sealant is dispensed on the cover lid before mounting the lid and cured by UV light after placing the lid on the substrate.

[0011] The adhesive tape used to attach the cover lid to the lid holder is treated such that it loses its adhesive property. The substrate and lid holders are then separated and the encapsulated OLED device released.

[0012] The sealing procedure produces a thin and flexible cavity structure that provides hermetic sealing against oxygen and moisture. Thin or ultra thin glass substrates can be used to provide higher mechanical flexibility than conventional thick glass substrates. The overall OLED device thickness achieved is less than 0.5 mm. The procedure is compatible with sensitive OLED materials and is scalable to cost-effective mass production.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013]FIG. 1 shows a conventional OLED device;

[0014]FIG. 2 shows a thin flexible OLED device;

[0015]FIG. 3 shows a substrate holder;

[0016]FIG. 4 shows a cover lid holder; and

[0017] FIGS. 5-8 show a process for encapsulating an OLED device in accordance with one embodiment of the invention.

PREFERRED EMBODIMENTS OF THE INVENTION

[0018]FIG. 2 shows a thin flexible OLED device 200 according to one embodiment of the invention. The OLED device comprises a substrate 240 on which active components are formed in the device region thereof. The active components, for example, comprise OLED pixels, segments or other patterns. In one embodiment, the substrate comprises a transparent substrate, such as glass. The substrate, for example, can be made from silicate glass such as borosilicate glass. Other transparent materials, such as plastic, sodalime glass or other types of glass, are also useful. Typically, the thickness of the thin substrate is less than about 0.5 mm, preferably about 0.01-0.2 mm.

[0019] The OLED active components 210 comprise one or more organic layers sandwiched between 2 electrodes. A lid 220 is provided to encapsulate the OLED pixels. The lid layer comprises, for example, a metal or glass. Other types of cover lids, which protect the active components from the environment, such as ceramic or metallized foil, are also useful. Typically, the cover lid exhibits a thickness of 0.01 mm to 0.2 mm.

[0020] In one embodiment, adhesive 230 is used to mount the lid. Adhesives such as self-hardening adhesives, UV or thermal curable adhesives, or hot melt adhesives are useful. Other techniques that employ low temperature solder materials, ultrasonic bonding, or welding techniques using inductance or laser welding are also useful.

[0021] A substrate holder and a lid holder are provided to handle the thin fragile substrate and cover lid. Referring to FIG. 3, a substrate holder 300 with alignment pillars 330 is provided. The pillars ensure precise positioning of the lid holder and the substrate holder when the lid holder is placed on the substrate holder. Other types of mechanical guides are also useful.

[0022] In one embodiment of the invention, mechanical guides are used to keep the substrate in the correct position. In FIG. 3, a cavity 320 is provided to hold and align the substrate. Alternatively, the substrate can be kept from moving out of position by a vacuum chuck. In another embodiment, an adhesive tape that loses its adhesion after some treatment (e.g. heat exposure or UV radiation) is used.

[0023]FIG. 4 shows a cover lid holder 400 that is used to place the thin flexible lid on the substrate. Alignment guides 440 are provided to align the lid holder with the substrate holder. In one embodiment of the invention, a glass support 420 that is transparent to UV radiation is used to cover the lid so that UV light can permeate and cure the UV-curable sealant during the sealing process. The areas where the sensitive OLEDs are located are shielded from the radiation. In another embodiment, the lid cover holder contains an ultraviolet lamp for curing the UV-curable sealant. In yet another embodiment of the invention, the cover lid holder contains an infrared lamp for curing a thermal-curable sealant. Alternatively, if thermal-curable sealant is used, the area above the sealant region is made transparent to infrared radiation to allow the radiation to pass through and cure the sealant.

[0024] In a preferred embodiment of the invention, a special adhesive release tape 430 that loses its adhesive property after a treatment process, such as heat exposure or UV radiation, is used to keep the lid from moving out of place. The tape can have adhesive coating either on one side or on both sides. In one embodiment, the adhesive tape is fixed to a tool, which attaches the tape to the lid. In yet another embodiment, a vacuum chuck is used to keep the lid in place.

[0025] FIGS. 5-8 show a process for encapsulating the OLED device in accordance with one embodiment of the invention. Referring to FIG. 5, the thin flexible lid 220 is attached to the lid holder 510 using adhesive release tape 430. The surface of the lid holder on which the lid is placed should show low adhesion to the sealant 230 used (e.g. epoxy resin). This is to ensure that the substrate with the lid can easily be removed from the lid holder after applying and curing the sealant. If any adhesive tape is used to attach the lid to the holder, it should also show low adhesion to the adhesive tape.

[0026] In one embodiment of the invention shown in FIG. 6, the substrate 240 containing the OLED is positioned on the substrate holder 300. The substrate on the substrate holder should be held in place by a vacuum chuck, adhesive release tape or mechanical guides.

[0027] The rim of the substrate, which is the sealing region, has to be clean before the lid is placed on the substrate. In one embodiment, the substrate undergoes a cleaning treatment along the rim. Cleaning methods include laser cleaning, wet chemical treatment, dry cleaning, mechanical treatment or a combination of all these methods. In another embodiment, the sealing region is protected by masking before or during the sealing procedure.

[0028] Referring to FIG. 7, the cover lid holder 400 containing the thin flexible lid is aligned with the substrate holder 300 containing the substrate. In one embodiment of the invention, the substrate holder and lid holder contain mechanical guides to ensure precise positioning of the lid holder with respect to the substrate holder. In one embodiment, the substrate holder is positioned on top of the lid holder. Alternatively, the lid holder is positioned on top of the substrate holder.

[0029] In one embodiment of the invention, the sealant 230 is dispensed onto the lid before mounting the lid onto the substrate. Alternatively, the sealant is dispensed onto the substrate before mounting. In yet another embodiment, the sealant is dispensed onto the substrate after placing the lid onto the substrate.

[0030] After dispensing the sealant, the lid holder and the substrate holder are pressed together to ensure good contact of the lid cover with the substrate. In one embodiment of the invention, the sealant is cured using UV radiation, thus hermetically sealing the OLED device. Alternatively, infrared radiation, heat treatment or a combination of these treatments can be applied to cure the sealant.

[0031] If the adhesive tape that is used to attach the substrate or lid to the holders has not lost its adhesion after curing the sealant, the apparatus is placed either on a hot plate, if heat release tape is used, or under a UV lamp, for UV release tape. Alternatively, if other types of special adhesive tape are used, the apparatus is subjected to the treatment that makes the tape lose its adhesive property.

[0032] After the treatment, the substrate holder and cover lid holder are separated and the encapsulated device is safely taken out, as shown in FIG. 8, without breaking the lid or the substrate. The present invention is not limited to the processing of a single unit. For example, multiple units which are formed on a single large substrate can be encapsulated in parallel and subsequently separated into individual units. Application of the invention is not limited to a single unit. It is also possible to encapsulate the units before singulation while they are still combined on the mother glass.

EXAMPLE

[0033] The OLED is prepared on a thin flexible substrate (50 μm thick, 50 mm×50 mm) using conventional techniques. The substrate is placed on the substrate holder. A flexible cover lid for sealing is attached to the lid holder using heat release tape from Nitto Denko. The flexible lid is 50 μm thick and has dimensions 22 mm by 22 mm. Epoxy resin is dispensed along the perimeter of the lid for sealing. The cover lid is placed onto the substrate by placing the lid holder on top of the substrate holder, positioned by mechanical guides on the substrate and lid holders. An ultraviolet lamp is used to cure the epoxy sealant. The apparatus is then placed on a hotplate at 130 degrees Celsius for 1 minute. The heat release tape loses its adhesion and safely releases the encapsulated OLED device onto the substrate holder.

[0034] While the invention has been particularly shown and described with reference to various embodiments, it will be recognized by those skilled in the art that modifications and changes may be made to the present invention without departing from the spirit and scope thereof. The scope of the invention should therefore be determined not with reference to the above description but with reference to the appended claims along with their full scope of equivalents. 

What is claimed is:
 1. A method for encapsulating a substrate on which a device is formed comprising: mounting a substrate, including a device region, on a substrate holder; mounting a cover lid on a lid holder; aligning the lid holder with the substrate holder, causing the substrate to be in contact with the cover lid, wherein the lid is sealed to the substrate to encapsulate the device; releasing the encapsulated device from the substrate holder and lid holder; and performing additional processing to complete the device.
 2. The method of claim 1 wherein the device comprises an OLED device.
 3. The method of claim 2 wherein the substrate comprises a transparent material.
 4. The method of claim 2 wherein the substrate comprises a flexible material.
 5. The method of claim 2 wherein the substrate comprises glass or plastic.
 6. The method of claim 5 wherein the substrate comprises a thickness of about 0.01 mm to 0.2 mm.
 7. The method of claim 2 wherein the substrate holder comprises mechanical guides to hold the substrate in place.
 8. The method of claim 7 wherein the substrate holder comprises a cavity to hold the substrate in place.
 9. The method of claim 2 wherein mounting the substrate on the substrate holder further comprises attaching the substrate to the substrate holder.
 10. The method of claim 9 wherein the method of attachment comprises using a vacuum chuck or adhesive release tape.
 11. The method of claim 1 wherein the substrate comprises a transparent material.
 12. The method of claim 11 wherein the substrate comprises a flexible material.
 13. The method of claim 12 wherein the substrate comprises glass or plastic.
 14. The method of claim 13 wherein the substrate comprises a thickness of about 0.01 mm to 0.2 mm.
 15. The method of claim 1 wherein the substrate holder comprises mechanical guides to hold the substrate in place.
 16. The method of claim 15 wherein the substrate holder comprises a cavity to hold the substrate in place.
 17. The method of claim 1 wherein the substrate is attached to the substrate holder.
 18. The method of claim 17 wherein the method of attachment further comprises using a vacuum chuck or adhesive release tape.
 19. The method of claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17 or 18, wherein the cover lid material comprises metal, glass, ceramic, plastic or metallized foil.
 20. The method of claim 19 wherein the cover lid comprises a thickness of about 0.01 mm to 0.2 mm.
 21. The method of claim 20 wherein mounting the cover lid on a lid holder further comprises applying a sealant in the sealing region, the sealant hermetically sealing the substrate and the cover lid.
 22. The method of claim 21 wherein the sealing region on the substrate undergoes a cleaning treatment before sealing.
 23. The method of claim 22 wherein the cleaning treatment comprises laser cleaning, wet chemical treatment, dry cleaning, mechanical treatment or a combination of these methods.
 24. The method of claim 23 wherein the surface of the lid holder on which the lid is placed shows low adhesion to the sealant.
 25. The method of claim 24 wherein the sealant comprises UV-curable sealant.
 26. The method of claim 25 wherein the lid holder comprises an ultraviolet lamp for curing the sealant.
 27. The method of claim 25 wherein the lid holder comprises a glass support that is transparent to UV radiation so that UV light can permeate and cure the sealant during the sealing process.
 28. The method of claim 24 wherein the sealant comprises thermally-curable sealant.
 29. The method of claim 28 wherein the lid holder comprises an infrared lamp for curing the sealant.
 30. The method of claim 28 wherein the lid holder comprises a support that is transparent to infrared radiation so that infrared light can permeate and cure the sealant during the sealing process.
 31. The method of claim 24 wherein the sealant comprises self-hardening adhesives or hot melt adhesives.
 32. The method of claim 23 wherein sealing the lid to the substrate comprises soldering, ultrasonic bonding, inductance or laser welding.
 33. The method of claim 20 wherein the lid holder comprises mechanical guides to align the lid holder with the substrate holder.
 34. The method of claim 33 wherein the substrate holder comprises mechanical guides to align the lid holder with the substrate holder.
 35. The method of claim 34 wherein the mechanical guides comprise alignment pillars.
 36. The method of claim 20 wherein mounting the cover lid on the lid holder further comprises attaching the lid to the lid holder.
 37. The method of claim 36 wherein the method of attachment comprises using a vacuum chuck.
 38. The method of claim 36 wherein the method of attachment comprises using an adhesive release tape that loses its adhesive property after some treatment.
 39. The method of claim 38 wherein the treatment comprises exposure to heat or UV radiation.
 40. The method of claim 39 wherein the adhesive tape is fixed to a tool that attaches the tape to the lid.
 41. The method of claim 38 wherein the surface of the lid holder on which the lid is placed shows low adhesion to the adhesive tape.
 42. The method of claim 38 wherein releasing the encapsulated comprises subjecting the adhesive tape to treatment that makes the tape lose its adhesive property.
 43. The method of claim 42 wherein the treatment comprises exposure to heat or UV radiation. 